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Standard Films: SiOx, SiNx, Poly-Si, a-Si:H, SiCx, a-C:H, TiNx, AIOx |
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Transparent Conductors (e.g. ITO) |
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Photoresists, ARCs, Polymers, Polyimides |
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Thin Metal Films |
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Chalcogenide Films |
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Silicon on Insulator (SOI) |
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Epi-Si and Epi-SiC |
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MEMS Si membranes |
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Films on rough substrates |
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Films inside print-head-type nozzles |
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Inhomogeneous films |
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Multi-layer periodic superstructures |
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Ultra-thin films (down to a few A) |
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Ultra-thick films (~100 μm or above) |
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Substrates other than Si (e.g. GaAs, SiC, Metals, Qz) |
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Full Profile for both 2-D (Trench) and 3-D (Contact Hole) Structures |
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Pitches: Small (<100 nm) to Large (>3 μm) |
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Measurements of Complex Trench and Hole Structures of Various Shapes |
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Shallow and Deep Trenches and Contact Holes |
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High Aspect Ratio Trenches and Contact Holes |
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Films Incorporated within Trenches and Contact Holes |
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Poly Recess, Oxide Recess, Contact Trench, Qz Etch Depth |
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Bottom and Corner Rounding. |
