Highly Automated Mask Aligner Platform for 300mm and 200mm Wafers
The second generation of the SUSS MicroTec MA300 Gen2 is a highly automated mask aligner platform for 300mm and 200mm wafers. It is specifically designed for 3D Packaging, wafer level packaging and flip-chip applications but can be used as well for other technologies where geometries in the range of 3 and 100 microns have to be exposed. The MA300 Gen2 represents a new generation of mask aligners from SUSS MicroTec that are designed to address the requirements of modern high-end fabs in a high volume manufacturing environment.
• Full-field intensity 90mW/cm² (broad band) • 3% Light Uniformity • 100 percent edge exposure flexibility (easy EBR) • Resolution down to 3 µm in Proximity Mask • Alignment accuracy 0.5 µm (3 sigma), with DirectAlign option • Can be equipped with a dedicated alignment kit for creating 3D interconnects • 20% throughput enhancement compared to previous generation (MA300 Plus) • Offers a large variety of options
Keyword : 마스크 얼라이너, 마스크얼라이너, SUSS MicroTec, 반도체 장비, 반도체장비