The MA200Compact combines proven mask aligner technology with a variety of innovative features that make it the system of choice for thick resist MEMS applications (i.e. Inkjet Heads, accelerometers, HDD), Advanced Packaging (i.e. 3D-packaging, fan-out, WLP, bumping), Compound Semiconductor (i.e. HBLED) and Micro Optics (i.e. Wafer Level Camera).
• Alignment accuracy (TSA): < 0.5µm (Direct Align option) • Alignment accuracy (BSA): < 1µm • High throughput: > 100wph • Advanced lithography: new MO Exposure Optics • Intensity uniformity: down to 2% (200mm) • Constant dose accuracy: 1,5% • Resolution: < 1 µm L/S (vacuum contact, 200mm) • Offers a large variety of options
Keyword : 마스크 얼라이너, 마스크얼라이너, SUSS MicroTec, 반도체 장비, 반도체장비