Based on SUSS MicroTec''s production proven mask aligner design the MA100/150e Gen2 enables exceptional process scalability and fast time-to-market for new device designs, while the industry leading throughput of 145 wafers per hour reduces cycle time.
The MA100/150e Gen2 is optimized for wafers sizes up to 6". The system reliably achieves an alignment accuracy of < ±0.7 µm (DirectAlign). Bottom-side alignment (BSA) is optionally available offering an alignment accuracy of < ±1.5 µm. The alignment unit of the MA100/150e is tailored to the specific requirements of LED manufacturing, offering excellent contrast even on transparent and textured wafers.
For applications using scribe lines the new ''Line Alignment'' function allows precise alignment of pre-scribed sapphire wafers to the photo mask without need of traditional wafer targets
• Dedicated Mask Aligner Solution for HB-LEDs, Power Devices, RF-MEMS etc. • Simultaneous handling of 3 wafers allows > 145 wph. incl auto-alignment and exposure • Multi-size tooling minimizes time required for wafer size changes • SUSS Diffraction Reducing Optics allows proximity printing for challenging resolution requirements (down to 2.5µm L/S at 20µm exposure gap in thick resist on 100mm wafer) • Non-contact prealignment avoids wafer damages • The ''Line Alignment'' function for sapphire wafers aligns scribe lines precisely to the photo mask • Alignment accuracy 0.5 µm (3 sigma), with DirectAlign option • Advanced lithography: new MO Exposure Optics
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